Path: utzoo!utgpu!jarvis.csri.toronto.edu!rutgers!sunybcs!kitty!larry
From: larry@kitty.UUCP (Larry Lippman)
Newsgroups: sci.electronics
Subject: Re: Surface-mount chips
Summary: Strong and steady hands...
Message-ID: <3243@kitty.UUCP>
Date: 18 Jun 89 16:28:17 GMT
References: <465@sdcc15.ucsd.edu> <25991@amdcad.AMD.COM> <19590@cup.portal.com>
Distribution: usa
Organization: Recognition Research Corp., Clarence, NY
Lines: 24

In article <19590@cup.portal.com>, mmm@cup.portal.com (Mark Robert Thorson) writes:
> [Discussion about replacing SMD deleted]
> ...
> Unless you have a soldering iron with a very fine tip, you may have trouble
> making the connections to the pads on the board.  What I do in this situation
> is to get out my old soldering GUN, wrap about 4 or 5 turns of heavy copper
> wire around the tip, then bend the end of the wire forward to form a tiny
> tip.  The tiny tip should be no more than about 1/2 inch from the regular
> tip of the gun, because otherwise you lose too much heat to melt solder.

	I'm impressed.

	You must have both an awfully steady and strong hand in order to
position a couple-pound soldering gun (even with a "fine tip") well enough
to solder wire to SMD pads!

	On a more serious note, I would be rather concerned about stray
leakage currents from the soldering iron destroying CMOS circuits, since
I don't know of any soldering gun which has grounded elements.

<>  Larry Lippman @ Recognition Research Corp. - Uniquex Corp. - Viatran Corp.
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