Path: utzoo!utgpu!jarvis.csri.toronto.edu!rutgers!apple!usc!cs.utexas.edu!uunet!fibercom!lab
From: lab@fibercom.UUCP (Lance Beckner)
Newsgroups: sci.electronics
Subject: Warp Factor 5
Keywords: Help!
Message-ID: <753@fibercom.UUCP>
Date: 20 Jun 89 12:00:41 GMT
Organization: FiberCom, Inc., Roanoke, VA
Lines: 15


Can anybody give me some info on how to best eliminate warping that
results when a PC board goes through flow soldering?  We have a
good number of eight layer boards (6.3" X 9.2" X .063") and so far,
every one has come out warped.  Other than just playing around with
solder temperature and time, is there anything I could/should do?

Please E-mail me any suggestions, and I'll post a summary later.

Thanks in advance.
-- 
Lance A. Beckner                   INTERNET: lab@fibercom.com
FiberCom, Inc.                     UUCP: ...!uunet!fibercom!lab
P.O. Box 11966                     FAX: (703) 342-5961
Roanoke, VA  24022-1966            PHONE:  (703) 342-6700