Path: utzoo!attcan!utgpu!jarvis.csri.toronto.edu!mailrus!ames!ncar!boulder!unicads!les
From: les@unicads.UUCP (Les Milash)
Newsgroups: comp.arch
Subject: Re: Claimed bug in 80286
Message-ID: <609@unicads.UUCP>
Date: 22 Aug 89 15:32:22 GMT
References: <1989Aug13.023601.594@utzoo.uucp> <310@hitech.ht.oz> <21352@cup.portal.com> <1877@brwa.inmos.co.uk>
Reply-To: les@unicads.UUCP (Les Milash)
Organization: Unicad  Boulder, CO
Lines: 9

In article <21352@cup.portal.com> mmm@cup.portal.com (Mark Robert Thorson) writes:
>The 386 and beyond have both device type and mask stepping numbers
                                              ^^^^^^^^^^^^^^^^^^^^^
do you mean the x,y of the individual die on the wafer!?!?!?  yikes!

i can see how that'd be useful, but seems like a royal pain if each die on
the wafer had to be different!

Les Milash, scheme zealot and recent S&M (shared memory) convert.