Path: utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!gem.mps.ohio-state.edu!ginosko!aplcen!haven!umbc3!chimiak
From: chimiak@umbc3.UMBC.EDU (Mr. William J. Chimiak )
Newsgroups: comp.dcom.lans
Subject: Re: high speed networking between buildings
Message-ID: <2314@umbc3.UMBC.EDU>
Date: 19 Sep 89 21:18:55 GMT
References: <4574@ursa-major.SPDCC.COM> <337@ai.etl.army.mil> <Sep.18.23.42.02.1989.1290@geneva.rutgers.edu>
Reply-To: chimiak@umbc3.umbc.edu.UMBC.EDU (Mr. William J. Chimiak (MMA))
Organization: University of Maryland, Baltimore County
Lines: 10

Why not use FDDI?  Interphase just announced their single ring interface
that allows single MAC attachement.  With 2 boards you get fault tolerant
dual MAC access.  The board delivers 100Mbps at the data link
layer if I am not mistaken.  With upper layer protocols invoked (XTP and
the like) 20 Mbps has been realized at a node.  Because the PHY and PMD
layers support the full 100 Mbps, you can have some EMI resistant high
speed networking with true future growth potential as it is an ANSI standard.

The latest issue of EDN talks of broadband networking with FDDI.  In it,
they predict a $500/node cost as economies of scale come into play.