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From: phil@diablo.amd.com (Phil Ngai)
Newsgroups: sci.electronics
Subject: Re: OTP (really?) EPROMS
Message-ID: <27785@amdcad.AMD.COM>
Date: 17 Oct 89 00:44:44 GMT
References: <841@dms.UUCP> <15357@vlsisj.VLSI.COM> <23127@cup.portal.com>
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Reply-To: phil@diablo.AMD.COM (Phil Ngai)
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Organization: Advanced Micro Devices, Inc. Sunnyvale CA
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In article <23127@cup.portal.com> mmm@cup.portal.com (Mark Robert Thorson) writes:
|davidc@vlsisj.VLSI.COM (David Chapman) says:
|> You'd better believe they test the whole thing with wafer probing.  No
|> semiconductor company worth its salt would ship partially-tested chips.
|
|That's true when such testing is possible.  FPLA's and PAL's, however, must
|be shipped with only partial testing because the fusemap can't be tested
|without burning it.

To pick a nit, there are plenty of UV and EE PALs now.

More seriously, I have burned plenty of PALs and never had a failure
to program. I don't know how the testing works but the bottom line is
the products are very reliable. 

--
Phil Ngai, phil@diablo.amd.com		{uunet,decwrl,ucbvax}!amdcad!phil
Just say NO to the "War on Drugs".