Path: utzoo!utgpu!jarvis.csri.toronto.edu!rutgers!tut.cis.ohio-state.edu!gem.mps.ohio-state.edu!apple!bionet!ames!amdahl!amdcad!diablo!phil
From: phil@diablo.amd.com (Phil Ngai)
Newsgroups: sci.electronics
Subject: Re: ground bounce
Message-ID: <27856@amdcad.AMD.COM>
Date: 23 Oct 89 21:18:10 GMT
References: <27746@amdcad.AMD.COM> <29700@obiwan.mips.COM> <809@anasaz.UUCP>
Sender: news@amdcad.AMD.COM
Reply-To: phil@diablo.AMD.COM (Phil Ngai)
Organization: Advanced Micro Devices, Inc. Sunnyvale CA
Lines: 18

In article <809@anasaz.UUCP> john@anasaz.UUCP (John Moore) writes:
|>In article <27746@amdcad.AMD.COM> phil@diablo.amd.com (Phil Ngai) writes:
|>AMD has an application brief titled "Minimization of Ground Bounce
|
|Presumably AMD was thus well prepared for the earthquake! ;>)

According to AMD's PR person, semiconductor fabrication is very
sensitive to vibrations and the modifications made to the buildings to
control vibrations also made them strong enough to handle the
earthquake and there was no damage. 

I don't think I'll comment on this beyond saying that I am not
speaking for the company. 


--
Phil Ngai, phil@diablo.amd.com		{uunet,decwrl,ucbvax}!amdcad!phil
Just say NO to the "War on Drugs".