Path: utzoo!attcan!utgpu!jarvis.csri.toronto.edu!mailrus!uwm.edu!cs.utexas.edu!oakhill!joej From: joej@oakhill.UUCP (Joe Jelemensky) Newsgroups: comp.sys.mac Subject: Encapsulated Postscript Message-ID: <2730@sol.oakhill.UUCP> Date: 12 Dec 89 22:17:53 GMT Organization: Motorola Inc. Austin, Tx Lines: 35 Just what is "Encapsulated Postscript"? I've seen this term used a lot lately amongst Mac & Sun dialog. 1. I assume it's a Postscript program with some header and/or footer wrapped around it. Right or wrong? 2. Is there some standard encapsulation info which goes on the front and/or back? If so, what is the standard and/or where is it defined? 3. How does one "Encapsulate" a Postscript program? 4. How does one use "Encapsulated Postscript"? I assume it is to be able to embed a Postscript program into another document which eventually gets printed on a laser printer of some sort (not necessarily Apple). Right or wrong? I know how to capture the Postscript form of a document from a Mac. Now how do I encapsulate it so it can used on say a Sun workstation document processor? (Example: Company logo drawn to spec on a Mac which I would like to embed in specifications done on a Sun). Thanks in advance. .__________________________________________________________________________. | ***** | |Joe Jelemensky * * | |Semiconductor Products Sector (SPS) * ********* | |Microprocessor Products Group (MPG) ****** * | |Microcontroller Division (MCU) * OAKHILL * | |Motorola, Inc. * * * .+ * | |USNAIL: 6501 William Cannon Drive West, Austin, TX 78735 ** * * | |NET: ...!cs.utexas.edu!oakhill!sol!joej * * | |AT&T: (512) 891-2243 IBM: RTA270@WACCVM2 ** | |__________________________________________________________________________|