Xref: utzoo misc.wanted:10229 sci.electronics:12864 sci.misc:4311 Path: utzoo!utgpu!news-server.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!ucsd!swrinde!zaphod.mps.ohio-state.edu!samsung!dali.cs.montana.edu!milton!uw-beaver!zephyr.ens.tek.com!tekcrl!tekgvs!lisav From: lisav@tekgvs.LABS.TEK.COM (Lisa Volpel) Newsgroups: misc.wanted,sci.electronics,sci.misc,tek.hardware Subject: Soldermask Tenting? Message-ID: <7797@tekgvs.LABS.TEK.COM> Date: 13 Jul 90 21:25:16 GMT Followup-To: poster Organization: Tektronix Inc., Beaverton, Or. Lines: 12 We are changing from dry film to LPI soldermask on some of our circuit boards. Are there any reliability problems / reports on incomplete via tenting (pinholes) with LPI soldermasks over vias? These are type I surface mount boards. They will not be wave soldered. Do you know WHERE to get more information? Thanx. Lisa Volpel (503)627-2483