Xref: utzoo sci.electronics:13133 comp.sys.intel:1309 Path: utzoo!utgpu!news-server.csri.toronto.edu!rutgers!att!cbnewsh!colin From: colin@cbnewsh.att.com (colin.alan.warwick) Newsgroups: sci.electronics,comp.sys.intel Subject: Wanted: process data for Intel i486(tm) Keywords: i486(tm) Intel Message-ID: <1990Jul26.145209.22432@cbnewsh.att.com> Date: 26 Jul 90 14:52:09 GMT Followup-To: poster Distribution: usa Organization: AT&T Bell Laboratories - Holmdel NJ Lines: 8 I am looking for data in the open literature on the process technology used in the Intel i486(tm). In particular I'd like die size, design rule (feature and gap), number and function of the masks and a break down of the component count. Also what does the H in "CHMOS IV" mean? Any data/references appreciated. advTHANKSance