Path: utzoo!attcan!uunet!wuarchive!zaphod.mps.ohio-state.edu!samsung!emory!mephisto!uflorida!mlb.semi.harris.com!thumper.mlb.semi.harris.com!jws From: jws@thumper.mlb.semi.harris.com (James W. Swonger) Newsgroups: sci.electronics Subject: Re: chips into powered sockets Message-ID: <1990Aug14.145937.27245@mlb.semi.harris.com> Date: 14 Aug 90 14:59:37 GMT References: <23655@dartvax.Dartmouth.EDU> Sender: news@mlb.semi.harris.com Distribution: sci.electronics Organization: Harris Semiconductor, Melbourne FL Lines: 18 In article <23655@dartvax.Dartmouth.EDU> charles.hitchcock@dartmouth.edu (Charlie Hitchcock) writes: > >Is hot-swapping a chip a bad idea? Why? What do >commercial chip test systems do? Yes. Some circuits can be damaged and you won't know if yours are susceptible until you try. Test programs float all pins for insertion and then power up the part. All bulk CMOS ICs have four-layer devices (i.e. parasitic SCRs) present due to the way they are fabricated. A phenomenon referred to as "latchup", the activation of the SCR, can be triggered by power supply spikes and other anomalous operating conditions. Once the SCR is on, you have a Vdd-Vss short which gets worse (runs away) until the cip is thermally damaged. This effect is dependent on the process and layout of the part in question. Some suppliers take measures to eliminate the latchup paths or reduce the sensitivity of the parasitic SCR.