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From: dmp@epg.harris.com (Donald Patterson)
Newsgroups: comp.lsi,sci.electronics
Subject: Wanted: Electronic CTE Failure Data
Keywords: thermal mismatch, failure
Message-ID: <4553@trantor.harris-atd.com>
Date: 17 Oct 90 13:55:34 GMT
Sender: news@trantor.harris-atd.com
Lines: 17

I am in the beginning stages of writing an expert system which would
"design around" potential failures due to thermal mismatch. As part of
the knowledge engineering task, I am interested in
1) Information about a failure or reliability problem known to be (at
least partially) attributable to coefficient of thermal expansion (CTE)
mismatch.
2) How the problem was resolved
3) Any other "tricks of the trade" regarding electronics design to
circumvent these problems

Response by E-mail is appreciated, but posting response is fine. Thanks
in advance... 

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