Path: utzoo!attcan!uunet!jarthur!bridge2!mips!daver!bungi.com!news From: bdale@col.hp.com (Bdale Garbee) Newsgroups: comp.sys.nsc.32k Subject: Re: It lives (while cold anyway) Message-ID: <9010152136.AA01141@hpcsbg.col.hp.com> Date: 15 Oct 90 21:36:38 GMT Sender: news@daver.bungi.com Lines: 8 Approved: news@daver.bungi.com > Any hints (other than check all solder joints and IC seating)? Almost guaranteed to be a cold solder joint... take a soldering iron and just walk the whole board, reheating all of the joints until they flow and stop bubbling... that is the leading cause of temperature dependencies in things I've built or helped build... Bdale