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From: jg90@castle.ed.ac.uk (J Gourlay)
Newsgroups: sci.electronics
Subject: UV glue poser
Message-ID: <7459@castle.ed.ac.uk>
Date: 5 Dec 90 20:34:06 GMT
Sender: jg90@castle.ed.ac.uk
Organization: Edinburgh University Computing Service
Lines: 12


I was wondering if anyone has come across a particularly viscous,UV
curing glue for microelectronic chip packaging(glass to silicon).
Any info would be gratefully received as we are having great problems
with our current techniques.
                          James Gourlay
                         Dept.of Physics
                     University of Edinburgh
                         Mayfield Road
                           Edinburgh 
                            Eh9 3JZ.
                              U.K.


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