Xref: utzoo sci.energy:3747 sci.electronics:16760 Path: utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!wuarchive!rex!uflorida!mlb.semi.harris.com!thumper.mlb.semi.harris.com!jws From: jws@thumper.mlb.semi.harris.com (James W. Swonger) Newsgroups: sci.energy,sci.electronics Subject: Re: solar cells Message-ID: <1991Jan7.184225.19070@mlb.semi.harris.com> Date: 7 Jan 91 18:42:25 GMT References: <1991Jan5.025526.9284@cs.rochester.edu> <1991Jan5.222423.14844@bronze.ucs.indiana.edu> <1991Jan5.225316.12934@cs.rochester.edu> Sender: news@mlb.semi.harris.com Organization: Harris Semiconductor, Melbourne FL Lines: 19 Nntp-Posting-Host: thumper.mlb.semi.harris.com You don't necessarily have to use Arsenic. There are other N dopants, like Phosphorus. Even if you do use Arsenic, the As in the silicon is going to stay put. The concentration of As/Si is about 100ppm @ Nd=1E19. The only way to release it is to eat away the silicon with which it is mixed. In oxygen Si quickly forms a passivating oxide layer. HF is not commonly found in nature, so the oxide is not going anywhere. Relax. Quit yipping. Since solar cells require fewer masking steps they use fewer chemicals and produce less waste. (Each mask uses a given amount of photoresist, etchant, stripper, etc). A solar cell's life will be a tradeoff between efficiency (minimum metal coverage of Si) and interconnect life. A well encapsulated cell will escape corrosion problems. A cell with adequate current density margin on its metallization will not be subject to catastrophic failure; its lifetime would be limited by the creep of its junctions.