Path: utzoo!utgpu!news-server.csri.toronto.edu!rutgers!cs.utexas.edu!sdd.hp.com!caen!dali.cs.montana.edu!milton!sumax!ole!sss From: sss@ole.UUCP (Stephen Sugiyama) Newsgroups: comp.lsi Subject: Re: Volume chip costs. Keywords: MOSIS TinyChip masks wafer Message-ID: <1813@ole.UUCP> Date: 16 Feb 91 22:30:48 GMT References: <1991Feb14.103845.20434@news.iastate.edu> <16774@venera.isi.edu> <1991Feb15.115859.8285@news.iastate.edu> Reply-To: sss@ole.UUCP (Stephen Sugiyama) Distribution: usa Organization: Seattle Silicon Corporation, Bellevue, WA. Lines: 17 In article <1991Feb15.115859.8285@news.iastate.edu> mpurtell@iastate.edu (Purtell Michael J) writes: > I just toured our Microelectronics Research Center(ISU) yesterday and > was shown a mask for a chip. The mask only had one chip on it; not a whole > wafer's worth of replicates. Is this just the way it's done in a research > environment? > -- > Michael Purtell ---- mpurtell@iastate.edu You probably saw a reticle for a stepper. Both full-wafer (1:1) projection masks and reduction step-and-repeat projection reticles (usually 5X) are common in optical lithography. Stepping is becoming more prevalent since the resolution can be greater, larger wafers can be imaged, and there is a slightly higher tolerance to mask defects, at a cost of slower throughput. Sometimes both systems are used in a process for different projection steps. -- Stephen Sugiyama ole!sss@sumax.seattleu.edu