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From: rjk@sequent.com (Robert Kelley)
Newsgroups: sci.electronics
Subject: Prototyping with surface-mount IC's
Keywords: FE package
Message-ID: <53294@sequent.UUCP>
Date: 15 Feb 91 17:43:21 GMT
Sender: rjk@sequent.UUCP
Organization: Sequent Computer Systems, Inc.
Lines: 8

Well, I've got this nice 68340FE16 sample in a ceramic surface mount
package with 144 leads on 0.050 centers.  I want to experiment with it.
What viable approaches exist for prototyping and experimentation, as
opposed to production, with chips in packages like this?  Do I have to
prepare a surface-mount PC board for it?

Robert Kelley
rjk@sequent.com