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From: rustyh@epsl.umd.edu (Rusty Haddock)
Newsgroups: sci.electronics
Subject: Re: Prototyping with surface-mount IC's
Keywords: FE package
Message-ID: <1991Feb16.151237.25503@wam.umd.edu>
Date: 16 Feb 91 15:12:37 GMT
References: <53294@sequent.UUCP>
Sender: usenet@wam.umd.edu (USENET Posting)
Organization: Broadcast Sports Technology
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In article <53294@sequent.UUCP> rjk@sequent.com (Robert Kelley) writes:
>Well, I've got this nice 68340FE16 sample in a ceramic surface mount
>package with 144 leads on 0.050 centers.  I want to experiment with it.
>What viable approaches exist for prototyping and experimentation, as
>opposed to production, with chips in packages like this?  Do I have to
>prepare a surface-mount PC board for it?

Yes I also got a sample and wondered the same thing!  I think Emulation
Technology (ET) make adaptors to wirewrap etc but I can't find the 
catalogue at the moment.

Looks like a nice chip though!!