Path: utzoo!censor!geac!torsqnt!news-server.csri.toronto.edu!bonnie.concordia.ca!thunder.mcrcim.mcgill.edu!snorkelwacker.mit.edu!spool.mu.edu!uunet!shelby!portia.stanford.edu!loki.Stanford.edu!rosentha From: rosentha@loki.Stanford.edu (Peter A. Rosenthal) Newsgroups: sci.electronics Subject: Re: Superconducting Interconnects Message-ID: <1991Feb20.190601.20293@portia.Stanford.EDU> Date: 20 Feb 91 19:06:01 GMT References: <4450005@hpcc01.HP.COM> Sender: news@portia.Stanford.EDU (Mr News) Organization: Stanford University Lines: 21 Superconducting interconnects allow some performance advantages in certain applications. For short on chip wiring, they are not particularly useful. Aluminum can carry ample current, and the power dissipated by the wiring is small compared to the active device dissipation. The device resistances and contact resistance dominate over the wiring resistance too, so the rc time constants are not limited by the wiring. For connections greater than about 2 cm, the wiring resistance of high quality aluminum does indeed limit the performance both in terms of speed and dissipation of power. For very large IC's and chip to chip interconnects one would get a performance improvement by going to superconducting interconnects, but the problems of packaging ie. thermal expansion mismatch and heatsinking become major headaches. High temperature superconductors will probably be wedded to semiconducting IC's in the not to distant future but substantial basic research and development must be done first. Peter Rosenthal Brought to you by Super Global Mega Corp .com