Path: utzoo!news-server.csri.toronto.edu!cs.utexas.edu!sun-barr!lll-winken!elroy.jpl.nasa.gov!sdd.hp.com!hplabs!hpl-opus!hpnmdla!hpsadle!walter From: walter@hpsadle.HP.COM (Walter Coole) Newsgroups: comp.sys.handhelds Subject: Re: Soldered-in ROMs: 20/20 hindsight Message-ID: <760005@hpsadle.HP.COM> Date: 5 Mar 91 19:51:15 GMT References: <1750@madnix.UUCP> Organization: HP Signal Analysis Division - Rohnert Park, CA Lines: 8 I wasn't involved in this product, but I would think that the main limitation with using EEPROMs or EPROMs was size. For a given technology and die size, MAX(ROM) ~ 4xMAX(EPROM) ~ 16xMAX(EEPROM). I think that most people are be more satisfied (actual needs filled) than they would be with an easily upgraded machine with 1/16 the functions. Not an official statement by Hewlett Packard.