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From: lamb@brahms.udel.edu (Richard E Lamb)
Newsgroups: sci.electronics
Subject: Re: Optical interconnects
Message-ID: <19438@brahms.udel.edu>
Date: 8 Mar 91 02:41:53 GMT
References: <782@spim.mips.COM>
Organization: University of Delaware
Lines: 3

Is the question here to use OPTICAL interconnections between "chips".

    Or "EMP hardened" communications system between missle silos?