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From: mslater@cup.portal.com (Michael Z Slater)
Newsgroups: comp.arch
Subject: Re: Snakebytes (HP process technology)
Message-ID: <40812@cup.portal.com>
Date: 3 Apr 91 03:05:47 GMT
References: <1996@kuling.UUCP> <32580012@hpcuhe.cup.hp.com>
Organization: The Portal System (TM)
Lines: 17

Linley Gwennap from HP writes:

>While HP's IC
>processes are as good as anyone's, the Series 700 CPU is implemented
>in a 1.0 micron, 3-metal-layer CMOS process which is pretty standard
>throughout the industry.

I think this understates the value of HP's process.  IBM may have 3-layer
metal, but I am not aware of any commercially available microprocessor 
fabricated in a 3-layer metal process.  I'm not a process expert by a long
shot, but from what I understand, there is a speed advantage here.

Also, from casual discussions with others who have had chips fabbed at various
foundries, including HP, HP's process has a reputation for being one of the
fastest around.

Michael Slater, MIcroprocessor Report   mslater@cup.portal.com