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From: look@s30.csrd.uiuc.edu (Stephen Look)
Subject: Re: Surface mount advice wanted
Message-ID: <1991May31.195756.27448@csrd.uiuc.edu>
Sender: news@csrd.uiuc.edu (news)
Organization: UIUC Center for Supercomputing Research & Development
References: <IISAKKIL.91May28190249@vipunen.hut.fi> <3217@krafla.rhi.hi.is> <PRZEMEK.91May31140244@rrdstrad.nist.gov>
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Date: Fri, 31 May 91 19:57:56 GMT
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We use a hot air gun that originally was used for plastics welding. Just
circle the device a few times while gently lifting a corner with a Xacto
knife and within a few seconds the chip will pop off. This causes no damage
to chip or board. This works extremely well with leadless smd parts.
--
Steve Look	ka9szw				Center for Supercomputing R & D
look@s30.csrd.uiuc.edu				305 Talbot Lab  104 S. Wright 
(217) 244-5980					Urbana, IL 61801
        "No, we don't have any CRAYs here, they are down the street..."