Path: utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!swrinde!zaphod.mps.ohio-state.edu!ub!galileo.cc.rochester.edu!rochester!pt.cs.cmu.edu!gandalf.cs.cmu.edu!lindsay
From: lindsay@gandalf.cs.cmu.edu (Donald Lindsay)
Newsgroups: comp.arch
Subject: Three-Level Metal
Message-ID: <13560@pt.cs.cmu.edu>
Date: 21 Jun 91 04:22:07 GMT
Organization: Carnegie Mellon
Lines: 10


I notice that the new i860 is built with a 3-level-metal process.

I recall that Motorola promised to build the 88110 this way,
and someone posted here expressing disbelief.

So, is the i860 really the first? And how many of the upcoming
superscalars will be three layer?
-- 
Don		D.C.Lindsay 	Carnegie Mellon Robotics Institute