Path: utzoo!utgpu!news-server.csri.toronto.edu!bonnie.concordia.ca!uunet!stanford.edu!agate!darkstar!ararat!karplus From: karplus@ararat.ucsc.edu (Kevin Karplus) Newsgroups: comp.lsi Subject: Re: capacitive/inductive coupling between routing traces? Message-ID: <17147@darkstar.ucsc.edu> Date: 18 Jun 91 01:14:16 GMT References: <1991Jun12.135839@agni.pa.dec.com> Sender: usenet@darkstar.ucsc.edu Reply-To: karplus@ce.ucsc.edu (Kevin Karplus) Lines: 32 In response to Vivek's request: ---I'm looking for information/references for computing capacitive and ---inductive coupling between adjacent i) routing traces on chips and ii) ---etch on printed circuit boards. I'd like to use these to compute the ---amount of crosstalk. Try Chapter 7 of Bakoglu's book "Circuits, Interconnections, and Packaging for VLSI" 7 Cross talk and power distribution noise 7.1 reflections, cross talk, and simultaneous switching noise 7.2 optimal line impedance 7.3 cross talk 7.3.1 modeling coupled transmission lines 7.3.2 calculating coupling constant 7.3.3 apacitance and inductance matrices 7.3.4 crosstalk in homogeneous and inhomogeneous mediums 7.3.5 near- and far-end noise 7.3.6 coupling between inhomogenous lines 7.3.7 reducing cross talk ... Information from the MELVYL catalog: Author: Bakoglu, H. B., 1958- Title: Circuits, interconnections, and packaging for VLSI / by H.B. Bakoglu. Reading, Mass. : Addison-Wesley Pub. Co., 1990. Description: xiv, 527 p. : ill. ; 24 cm. Series: Addison-Wesley VLSI systems series. ISBN: 0201060086 : $28.95 (est.)