Path: utzoo!utgpu!news-server.csri.toronto.edu!rpi!zaphod.mps.ohio-state.edu!swrinde!cs.utexas.edu!uunet!lll-winken!aunro!atha!mips!wilkes From: wilkes@mips.com (John Wilkes) Newsgroups: comp.arch Subject: Re: Three-Level Metal Message-ID: <4977@spim.mips.COM> Date: 22 Jun 91 00:54:01 GMT References: <13560@pt.cs.cmu.edu> Sender: news@mips.COM Organization: MIPS Computer Systems, Inc., Sunnyvale, California Lines: 9 Nntp-Posting-Host: gherkin.mips.com In article <13560@pt.cs.cmu.edu> lindsay@gandalf.cs.cmu.edu (Donald Lindsay) writes: > >So, is the i860 really the first? And how many of the upcoming >superscalars will be three layer? The MIPS R6000 ECL processor, R6010 floating point controller and R6020 system bus chip are all three layer metal. -wilkes