Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: version B 2.10.2 9/18/84; site rochester.UUCP Path: utzoo!linus!philabs!cmcl2!seismo!rochester!ken From: ken@rochester.UUCP (Ken Yap) Newsgroups: net.lsi,net.wanted Subject: Re: HELP! What are these chips? Message-ID: <3373@rochester.UUCP> Date: Tue, 13-Nov-84 12:23:34 EST Article-I.D.: rocheste.3373 Posted: Tue Nov 13 12:23:34 1984 Date-Received: Thu, 15-Nov-84 01:58:04 EST References: <357@mako.UUCP> <1636@wateng.UUCP> <251@spp2.UUCP> Reply-To: ken@seneca.UUCP (Sue-Ken Yap) Organization: U. of Rochester, CS Dept. Lines: 16 Summary: In article <251@spp2.UUCP> heiss@spp2.UUCP writes: >On cracking open chips: the ceramic-sandwich packages are easily split >with old diagonal cutters, but what about the plastic packages? What tool >or chemical will expose the silicon for viewing? > You probably need a chemical that will dissolve the plastic (if such a chemical exists). These things are totally encapsulated (i.e. no cavity inside). Regards, -- Ken Yap UUCP: (..!{allegra, decvax, seismo}!rochester!ken) ARPA: ken@rochester.arpa USnail: Ken Yap, Dept. of Comp. Sci., U. of Rochester, NY 14627.