Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: version B 2.10.1 6/24/83; site umd5.UUCP Path: utzoo!watmath!clyde!burl!ulysses!allegra!bellcore!decvax!genrad!panda!talcott!harvard!seismo!umcp-cs!cvl!umd5!zben From: zben@umd5.UUCP Newsgroups: net.arch Subject: Re: Cube designs vs. x,y,z bus Message-ID: <342@umd5.UUCP> Date: Mon, 25-Feb-85 01:02:04 EST Article-I.D.: umd5.342 Posted: Mon Feb 25 01:02:04 1985 Date-Received: Thu, 28-Feb-85 01:16:00 EST References: <48@pbear.UUCP> <268@oliveb.UUCP> Reply-To: zben@umd5.UUCP (Ben Cranston) Organization: U of Md, CSC, College Park, Md Lines: 19 Summary: Minor quibble about IC physical manufacture In article <268@oliveb.UUCP> jerry@oliveb.UUCP (Jerry Aguirre) writes: > ... If the entire wafer of >silicon was used then the wasted area used for cutting the chips apart >could be eliminated. ... Well, until they start growing REALLY perfect silicon crystals in zero-gee (if in fact that is the real problem with growing perfect crystals) you would still have to deal with yield here. I suspect 60-75% yield on as complex a circuit as a microprocessor would be pretty good for the current state of the art (any flames?). So you might have to burn a map of the good processors into the chip after testing, like those Intel mag bubble chips... Network routing algorithms, anyone? ;-) -- Ben Cranston ...seismo!umcp-cs!cvl!umd5!zben zben@umd2.ARPA