Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: version B 2.10.2 9/18/84; site linus.UUCP Path: utzoo!linus!brando From: brando@linus.UUCP (T. J. Brando) Newsgroups: net.micro,net.arch Subject: Re: alternative to current circuit board technology Message-ID: <314@linus.UUCP> Date: Fri, 12-Apr-85 13:06:09 EST Article-I.D.: linus.314 Posted: Fri Apr 12 13:06:09 1985 Date-Received: Mon, 15-Apr-85 01:06:17 EST Distribution: net Organization: The MITRE Coporation, Bedford, MA Lines: 21 Xref: linus net.micro:8678 net.arch:887 In <9869@brl-tgr.ARPA>, CMP.WERNER@UTEXAS-20.ARPA (Werner Uhrig) writes: > [ from the Austin American Statesman, April 9, 1985 ] > > CIRCUIT BOARD UPDATE SHOWN > > MOSAIC SYSTEMS Inc, said Monday it has developed a small alternative to the > conventional circuit board on which computer chips are mounted. Mosaic's > process uses microscopic current conductors deposited on a wafer rather > than using wires to link chips together. "This long-awaited development > can make it possible to build much smaller, faster and more powerful > computers and to manufacture them at a lower cost," said Robert Johnson, > president of Mosaic Systems, which is based in Troy, Michigan. > > [ does anyone know what is being described here? Certainly, linking chips > together using wires doesn't sound like current methods. ---Werner ] I believe he was referring to WAFER-SCALE INTEGRATION. -- Thom Brando {allegra,decvax,ihnp4,philabs,utzoo,uw-beaver,...}!linus!brando.uucp