Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: version B 2.10.2 9/18/84; site brl-tgr.ARPA Path: utzoo!watmath!clyde!burl!ulysses!allegra!bellcore!decvax!genrad!panda!talcott!harvard!seismo!brl-tgr!tgr!BillW@SU-SCORE.ARPA From: BillW@SU-SCORE.ARPA (William Chops Westfield) Newsgroups: net.micro Subject: Re: How to fab One-Of-A-Kind systems? Message-ID: <10460@brl-tgr.ARPA> Date: Tue, 7-May-85 02:17:15 EDT Article-I.D.: brl-tgr.10460 Posted: Tue May 7 02:17:15 1985 Date-Received: Thu, 9-May-85 02:33:45 EDT Sender: news@brl-tgr.ARPA Lines: 19 Go wire wrap. I don't know where you heard tha wire wrap get unreliable as it ages, but I dont think that is true. From most indications, a wire wrap connection is as reliable as a soldered connection (the possible exception being in a high vibration environment). If you expect the prototype to last 50 years, aging might get you... At Stanford we have designed and built quite a bit of hardware, and it all gets wirewrapped first (that way you get to correct the mistakes a lot more easilly too). Designing a circuit board for any but the simplest circuit is both difficult and very expensive. Using sockets on the board would probably lower the reliabilty to that of wire-wrap (hmm - thats probably where the aging question came in - things in sockets (wire wrap or solder tail) tend to be less reliable than tyhings that are directly soldered to. BillW