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From: caf@omen.UUCP (Chuck Forsberg WA7KGX)
Newsgroups: net.arch,net.micro
Subject: Re: How to fab One-Of-A-Kind systems?
Message-ID: <158@omen.UUCP>
Date: Mon, 13-May-85 11:34:42 EDT
Article-I.D.: omen.158
Posted: Mon May 13 11:34:42 1985
Date-Received: Wed, 15-May-85 00:19:30 EDT
References: <202@ganehd.UUCP> <150@nic_vax.UUCP>
Organization: Omen Technology, Portland
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Xref: watmath net.arch:1186 net.micro:10351

I recently developed a moderately large board (a laser printer controller
with 1 MB ram, etc.) with the insulation displacement system.
We had considerable trouble with the sockets coming apart after repeated
insertions and withdrawl of the chips.

As for my next project, I might use the method if the board was small,
wasn't going to be used for very long, and I didn't expect to fuss with
it too much before getting it to work.

A prime advantage of the insulation displacement method is less board thickness
compared to wirewrap.  It's faster too, although a good stripper and/or
prestripped wires make wirewrap much faster.

With wirewrap, I find a manual tool ($5) better than the cheap electric
types.
-- 
Chuck Forsberg WA7KGX	..!tektronix!reed!omen!caf
Omen Technology Inc 17505-V NW Sauvie IS RD Portland OR 97231
Voice: 503-621-3406	Modem: 503-621-3746 (Hit CR's for speed detect)