Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: version B 2.10 5/3/83 based; site houxu.UUCP Path: utzoo!watmath!clyde!burl!ulysses!mhuxr!mhuxt!houxm!houxu!rbc From: rbc@houxu.UUCP (R.CONNAGHAN) Newsgroups: net.arch,net.micro Subject: Re: How to fab One-Of-A-Kind systems? Message-ID: <612@houxu.UUCP> Date: Fri, 10-May-85 17:39:26 EDT Article-I.D.: houxu.612 Posted: Fri May 10 17:39:26 1985 Date-Received: Sat, 11-May-85 03:59:47 EDT References: <10526@brl-tgr.ARPA> Organization: AT&T Information Systems, Holmdel NJ Lines: 25 Xref: watmath net.arch:1173 net.micro:10316 No one has mentioned Multiwire. Can be fabricated from schematics or a net list. Generally very fast turn-around compared to Printed Circuits. I have used most prototyping techniques, Wire-Wrap, Multiwire, PCB, and point to point. The favorite has gone from wire-wrap to Multiwire. A comment on wire-wrap robutness. It's not the wrapped connection reliability that causes problems. It't the intergratiy of the insulation. The insulation can often be nicked as it goes around a post. It can also were away if the board is flexed or moved alot. A wire-wrap system carefully built (automatically prefferred) and NOT MOVED or FLEXED much is a very reliable way to build. -- Robert Connaghan Microprocessor Group AT&T Bell Labs - Holmdel, N.J. houxu!rbc