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From: keithe@tekgvs.UUCP (Keith Ericson)
Newsgroups: net.micro
Subject: Re: Building 1 of a kind systems
Message-ID: <1093@tekgvs.UUCP>
Date: Fri, 10-May-85 11:42:06 EDT
Article-I.D.: tekgvs.1093
Posted: Fri May 10 11:42:06 1985
Date-Received: Sun, 12-May-85 04:40:31 EDT
References: <10467@brl-tgr.ARPA>
Reply-To: keithe@tekgvs.UUCP (Keith Ericson)
Organization: Tektronix, Beaverton OR
Lines: 12
Summary: 


On wire-wrapping a (prototype/1-of-a-kind) board: around here we have
had the same experience as many others have had in that the best
wire-wrapping system is one in which the wire is completely stripped
of insulation, either before or during the wrapping operation. The
wrappers that attempt to slice the insulation (or whatever it is that
they do) and essentially leave it in place on the wire are prone to
make poor/no connection. (These can usually be made to connect by
applying heat - a soldering iron works nicely - to the offending
connection pin, but first you have to find the bad connection!) 

keith ericson at teklabs