Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: version B 2.10.2 9/18/84; site brl-tgr.ARPA Path: utzoo!linus!philabs!cmcl2!seismo!brl-tgr!tgr!LMTRA@SRI-KL.ARPA From: LMTRA@SRI-KL.ARPA Newsgroups: net.micro Subject: Nobody here but us engineers Message-ID: <119@brl-tgr.ARPA> Date: Wed, 24-Jul-85 03:53:00 EDT Article-I.D.: brl-tgr.119 Posted: Wed Jul 24 03:53:00 1985 Date-Received: Thu, 25-Jul-85 23:03:20 EDT Sender: news@brl-tgr.ARPA Lines: 30 Return-Path: Received: from BRL-VGR.ARPA by SRI-KL.ARPA with TCP; Sat 20 Jul 85 19:39:41-PDT Received: from brl-tgr.arpa by VGR.BRL.ARPA id a019156; 20 Jul 85 21:54 EDT Received: from usenet by TGR.BRL.ARPA id a006912; 20 Jul 85 21:50 EDT From: bill%persci.uucp@BRL.ARPA . . >Are there any parts that you've seen in IC manufacturers data books or >spec sheets that are real hot, but not out yet? <