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From: grr@cbmvax.cbm.UUCP (George Robbins)
Newsgroups: net.micro.amiga
Subject: Re: Things that break w / the 68010
Message-ID: <654@cbmvax.cbmvax.cbm.UUCP>
Date: Tue, 19-Aug-86 02:10:05 EDT
Article-I.D.: cbmvax.654
Posted: Tue Aug 19 02:10:05 1986
Date-Received: Wed, 20-Aug-86 05:08:15 EDT
References: <256@neoucom.UUCP>
Reply-To: grr@cbmvax.UUCP (George Robbins)
Organization: Commodore Technology, West Chester, PA
Lines: 27
Keywords: Amiga Transformer is (another) one.

In article <256@neoucom.UUCP> wtm@neoucom.UUCP (Bill Mayhew) writes:
>
>	While I had the cover off my Amiga, I noticed that the 8364
>chip at position 4E gets disturbingly hot (true, it is in a ceramic
>package).  I'm thinking about adding a stick-on heatsink, since my
>Amiga is out of warranty anyway.  I'm curious which chip this is,
>Denise, Paula, Agnus...?
>
>Bill NE Ohio Univs' College of Med

This is Paula herself.  In general, chips are packaged in ceramic only
when they dissapate too much power for platic packages (or mil-spec).
The ceramic package has a much lower thermal resistance than a platic
package would.

I would do no harm to add such a heat sink, although the chip is
probably cool enough if you can leave your finger on it.

Trading off conductance == power dissipation vs. speed to optimize
yield is one of those games chip people have to play as the chip
searches for maturity.  High volume chips may go through many minor
revisons to gain incremental yield increases.

-- 
George Robbins - now working with,	uucp: {ihnp4|seismo|caip}!cbmvax!grr
but no way officially representing	arpa: cbmvax!grr@seismo.css.GOV
Commodore, Engineering Department	fone: 215-431-9255 (only by moonlite)