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From: jaro@utecfa.UUCP (Jaro A Pristupa)
Newsgroups: ut.vlsi
Subject: Status Report for May 86 IC Implementations
Message-ID: <1894@utecfa.UUCP>
Date: Wed, 10-Sep-86 17:00:26 EDT
Article-I.D.: utecfa.1894
Posted: Wed Sep 10 17:00:26 1986
Date-Received: Wed, 10-Sep-86 18:42:39 EDT
Organization: Engineering Computing Facility, University of Toronto
Lines: 18

I've got some good news and some bad news.  First, the good :

   I've received news from CMC (the Canadian Microelectronics
Corporation).  They say that they have received the components from
MPC8603 (the CMOS3 implementation in May) from Northern Telecom, and
the chips will be shipped within a few days.

Now the bad news : 

   Things are not going well with the CMOS1B (5-micron) implementation
in May ... the initial batch of wafers did not pass quality control
standards at Northern Telecom so the batch has been resubmitted for
fabrication.  The earliest estimate of availability of this submission
is six weeks from now -- somewhere near the end of October.

	Jaro Pristupa
	VLSI Research Group
	Dept of Electrical Engineering