Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Path: utzoo!mnetor!uunet!seismo!rutgers!ucla-cs!zen!ucbvax!hplabs!pyramid!voder!buyno From: buyno@voder.UUCP (Matthew Buynoski) Newsgroups: sci.physics,sci.space,comp.lsi Subject: Re: Radiation effects on semiconductors Message-ID: <2968@voder.UUCP> Date: Thu, 6-Aug-87 20:13:25 EDT Article-I.D.: voder.2968 Posted: Thu Aug 6 20:13:25 1987 Date-Received: Sat, 8-Aug-87 14:54:09 EDT References: <1356@ssc-vax.UUCP> <107@rdlvax.UUCP> <169@bernina.UUCP> Organization: National Semiconductor, Santa Clara Lines: 52 Keywords: radiation semiconductors Summary: rad hard and semiconductors hole electron pairs Xref: mnetor sci.physics:1985 sci.space:2380 comp.lsi:198 In article <169@bernina.UUCP>, peter@ethz.UUCP (Peter Beadle) writes: > In article <107@rdlvax.UUCP> kopaz@rdlvax.UUCP (John Anthony 'Echo' Kopaz) > > 1. What are the primary causes of radiation (in the largest sense of > the word) induced circuit failure. > > 2. What proportion of the effects are permenant and what proportion are > transitory. > > 3. What makes a radiation hard circuit "hard". We have already heard > about some quantitive measures of "hard", what I would like to know is > what I have to do to design a "hard" circuit. > > 4. What effects do process parameters have on radiation sensitivity. > > 5. I hear a lot about alpha particle hits on memories. What does an > alpha particle do as it passes through a 1Mbit D-ram. Answer to 1 (as I know it). The chief causes are: hole-electron pair generation in the oxide, and outright smushing of the semiconductor lattice. To the former: energetic particles in the oxide layers over the semiconductor create hole-electron pairs in the oxide. The electrons so generated are mobile enough to enter the semiconductor, but the holes are not. This leads to a build-up of positive holes along the Si-SiO2 interface. That in turn affects the electrical properties of the semiconductor near-surface region. Typical effects are the inversion of p-regions (bipolar bases, e.g.), shifts of threshold voltage in MOSFETs, lowered breakdown voltages due to field-induced junctions. The second effect is the outright damage to the lattice by the energeticparticles. These events tear up everything...all the diodes start to leak, oxides break down, etc. Usually the first mechanism occurs first. Answer to 2. They are mostly all permanent. Alas. The alpha-particle problem in memories is an example of transitory radiation "damage". In this case, many more hole-electron pairs are created in the holding capacitor of the DRAM cell, which effectively messes up the stored signal. A single alpha can create about 10e6 such pairs. The same alpha may well have also created a few hole-electron pairs in the oxide above the cell, doing permanent-type damage but at a slower rate (the oxide is thinner, and it is more difficult to create pairs in it than silicon, since the bandgap is considerably larger in SiO2). Actually, some of the effects are reversible, but with annealing at, say, 250 to300 degrees C. Not very practical in a working circuit. Answer to 3. Most of the things done to "rad hard" parts are done to reduce the surface state and fixed charge densities. Surface states are very nice homes for the radiation-generated holes and tend to bind them right on the interface, which is of course the absolute worst place for them. IF the holes don't have as many places to "settle in", it is possible that some of them may wander around and eventually find an electron to combine with..poof goes a bit of your trouble. Reducing fixed surface charge helps in that it is positive and if it is less, then it takes more holes to get you up to the point where the total positive charge is too much. Or, it pushes back the day of reckoning for a while. I think the answers to 4 and 5 are somewhere in the bulk of the answers to 1,2, and 3, so I won't repeat them here. Hope this helps.