Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Path: utzoo!mnetor!uunet!husc6!seraphim!clark From: clark@seraphim.harvard.edu (James J. Clark) Newsgroups: comp.lsi Subject: Re: Spice Parameters Message-ID: <2804@husc6.UUCP> Date: Sat, 5-Sep-87 19:24:27 EDT Article-I.D.: husc6.2804 Posted: Sat Sep 5 19:24:27 1987 Date-Received: Sun, 6-Sep-87 08:17:47 EDT Sender: news@husc6.UUCP Reply-To: clark@seraphim.harvard.edu (James J. Clark) Lines: 22 Keywords: spice model parameters Summary: Spice parameter lists from MOSIS Spice model parameters are provided by MOSIS whenever they send back a batch of fabricated integrated circuits to the designers. (note: MOSIS is DARPA sponsored service which interfaces between designers of integrated circuits and various fabrication facilities) They do tests on the wafers that the chips were located on to get the parameter values. One should be warned, however, that sometimes these measurements are not too accurate and may even be way off (this happened to me once). So one should look at the parameter values closely - if they look reasonable then they should be alright to use. If you want these typical spice parameters you may want to e-mail a request to MOSIS (at mosis@isi.b.edu) or you can e-mail myself and I will send you a few sets. James J. Clark Division of Applied Sciences Harvard University clark@seraphim.harvard.edu s beaarnMessaMessaMce irives w