Xref: utzoo sci.electronics:2857 rec.ham-radio:4691
Path: utzoo!mnetor!uunet!lll-winken!lll-tis!ames!ll-xn!mit-eddie!uw-beaver!cornell!calvin!kevin
From: kevin@calvin.EE.CORNELL.EDU (Kevin Tubbs)
Newsgroups: sci.electronics,rec.ham-radio
Subject: Re: Encapsulation in plastic for ruggedization
Message-ID: <343@calvin.EE.CORNELL.EDU>
Date: 26 Apr 88 03:17:51 GMT
References: <17420@glacier.STANFORD.EDU>
Reply-To: kevin@calvin.ee.cornell.edu.UUCP (Kevin Tubbs)
Organization: Cornell Space Plasma Physics Group
Lines: 13

In article <17420@glacier.STANFORD.EDU> jbn@glacier.STANFORD.EDU (John B. Nagle) writes:
>      I'm interested in ruggedization treatments for small PC boards.
>What are some good alternatives, preferably ones that won't affect
>tuned RF circuits?  I'd like a thick, clear coat covering the components.

The guys in my research group that build payloads for rocket experiments
use clear Dow/Corning RTV (expensive).  I think they either dip the boards,
or pour it on, then pour off the excess.  Makes a nice smooth coating.

-- 
Kevin Tubbs, 5152 Upson, Cornell University, Ithaca NY, 14853  (607) 255-8703
kevin@calvin.ee.cornell.edu  {uunet,rochester}!cornell!calvin!kevin
"If you took all the CP/M users in the world, and laid them end-
to-end at the equator, it would be a good thing."