Path: utzoo!utgpu!water!watmath!clyde!bellcore!rutgers!ucsd!nosc!helios.ee.lbl.gov!lll-tis!ames!elroy!mahendo!wlbr!scgvaxd!trwrb!aero!venera.isi.edu!sllu From: sllu@venera.isi.edu (Lien Lu) Newsgroups: comp.lsi Subject: MOSIS announcement Keywords: survey, double poly runs, MOSIS users Message-ID: <5924@venera.isi.edu> Date: 21 Jul 88 17:53:36 GMT Organization: USC-Information Sciences Institute Lines: 75 Dear MOSIS Users: This message is for all designers needing TWO levels of poly for their CMOS designs. In order to establish a schedule for TWO MICRON DOUBLE-POLY DOUBLE-METAL CMOS runs, MOSIS needs to know: 1. The number and size of designs that would be submitted for this technology over the next year. 2. Preference for P-well or N-well technology. We will only be able to provide runs in ONE of these technologies. We have developed interfaces to two vendors and we need to verify the demand before committing to runs. IF YOU ARE INTERESTED IN THIS TECHNOLOGY, PLEASE RESPOND TO THIS MESSAGE AS QUICKLY AS POSSIBLE. IF THE RESPONSE IS TOO LOW, WE WILL BE FORCED TO CONCLUDE THAT THE DEMAND IS NOT HIGH ENOUGH TO JUSTIFY ADDING A NEW TECHNOLOGY TO OUR PRODUCTION SCHEDULE. Please use the attached form for your response, and send it to . Thanks for your help! EXPECTED 2 MICRON 2 POLY 2 METAL DESIGN SUBMISSIONS SEP 88 - AUG 89 ----------------------------------------------------------------------------- NAME: ORGANIZATION: ------------------------------------------------------------------------------ SPONSOR (put an "X" by one of the following) DARPA NSF COMMERCIAL (PO direct from customer) ------------------------------------------------------------------------------ TECHNOLOGY PREFERENCE (put an "X" by one of the following) P WELL N WELL ------------------------------------------------------------------------------ NUMBER OF EXPECTED SUBMISSIONS ( fill in the squares with numbers ) SEP OCT NOV DEC JAN FEB MAR APR MAY JUN JUL AUG *************************************************************************** Tiny Chip | | | | | | | | | | | | | 2200x2250 u | | | | | | | | | | | | | | | | | | | | | | | | | | *************************************************************************** Small Die | | | | | | | | | | | | | up to | | | | | | | | | | | | | 4600x6800 u | | | | | | | | | | | | | *************************************************************************** Medium Die | | | | | | | | | | | | | up to | | | | | | | | | | | | | 6800x6900 u | | | | | | | | | | | | | *************************************************************************** Large Die | | | | | | | | | | | | | up to | | | | | | | | | | | | | 7900x9200 u | | | | | | | | | | | | | *************************************************************************** Oversize Die | | | | | | | | | | | | | greater than | | | | | | | | | | | | | 7900x9200 u | | | | | | | | | | | | | *************************************************************************** -------