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From: moreno@maui.cs.ucla.edu (Jaime Moreno)
Newsgroups: comp.lsi,comp.arch
Subject: Re: Hughes' 3-D Processor Array
Message-ID: <18778@shemp.CS.UCLA.EDU>
Date: 10 Dec 88 23:08:31 GMT
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Reply-To: moreno@cs.ucla.edu (Jaime Moreno)
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Organization: UCLA Computer Science Department
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The upcoming International Conference on Wafer Scale Integration
(January 3-5, San Francisco) will have three papers on the topic:

	- The 3-D Computer
	- Reliability of the 3-D Computer under stress of mechanical
	  vibration and thermal cycling
        - Redundancy for yield enhancement in the 3-D computer

The three papers are from people at Hughes Research labs.

Jaime Moreno

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Internet: moreno@CS.UCLA.EDU
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