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From: enbody@cpswh.cps.msu.edu (Dr Richard Enbody)
Newsgroups: comp.lsi,comp.arch
Subject: Re: Hughes' 3-D Processor Array
Message-ID: <1315@cps3xx.UUCP>
Date: 14 Dec 88 21:32:08 GMT
References: <288@coho.UUCP> <18778@shemp.CS.UCLA.EDU>
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Reply-To: enbody@cpswh.UUCP (Dr Richard Enbody)
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Organization: Engineering, Michigan State Univ., E. Lansing
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In article <18778@shemp.CS.UCLA.EDU> moreno@cs.ucla.edu (Jaime Moreno) writes:
>The upcoming International Conference on Wafer Scale Integration
>(January 3-5, San Francisco) will have three papers on the topic:
>
>The three papers are from people at Hughes Research labs.
>

I am very interested in this topic, but I am not going to the conference.
Is there anyone from Hughes reading this who could email (or mail)
copies or tell me who to contact for copies?
Thank you,
rich enbody