Xref: utzoo comp.lsi:611 sci.electronics:4492 Path: utzoo!attcan!uunet!ncrlnk!ncrcae!ece-csc!mcnc!rutgers!netnews.upenn.edu!eniac.seas.upenn.edu!blackman From: blackman@eniac.seas.upenn.edu (David Blackman) Newsgroups: comp.lsi,sci.electronics Subject: Surface mounted packages Summary: Any experience with them? Message-ID: <6683@netnews.upenn.edu> Date: 13 Dec 88 16:29:35 GMT Sender: news@netnews.upenn.edu Reply-To: blackman@axon.seas.upenn.edu (David Blackman) Distribution: na Organization: University of Pennsylvania Lines: 10 Expires: References: Sender: Followup-To: Keywords: We have an application where we'd like to mount our custom VLSI dies into a high density surface mounted package. Does anyone have any experience with vendors of these packages? Also: how about any recommendations for other types of high density packages. Due to cost considerations, we are most interested in plastic packages. Thanks, David Blackman@eniac.seas.upenn.edu