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From: shi@bonnie.ics.uci.edu (E. Shi)
Newsgroups: comp.arch
Subject: high density substrates
Message-ID: <3225@paris.ics.uci.edu>
Date: 6 Jan 89 14:18:06 GMT
Sender: news@paris.ics.uci.edu
Reply-To: shi@bonnie.ics.uci.edu (E. Shi)
Organization: University of California, Irvine - Dept of ICS
Lines: 13


   ...with regards to high-density substrates to handle the
      interconnect problem, I understand some companies are
      doing some very unique things.  

      some companies I hear of include UNISYS, HONEYWELL...
      also, anybody know if DEC really brought the old TRIOLOGY
      operations for its technology in high-density substrates --
      also known as WSI.

      anybody have details on this?

  -ed