Path: utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!csd4.milw.wisc.edu!lll-winken!uunet!mfci!rodman
From: rodman@mfci.UUCP (Paul Rodman)
Newsgroups: comp.arch
Subject: Re: DARPA supercomputer
Message-ID: <761@m3.mfci.UUCP>
Date: 10 Apr 89 00:15:23 GMT
References: <2866@uokmax.UUCP>
Sender: rodman@mfci.UUCP
Reply-To: rodman@mfci.UUCP (Paul Rodman)
Distribution: usa
Organization: Multiflow Computer Inc., Branford Ct. 06405
Lines: 21

In article <2866@uokmax.UUCP> les@uokmax.UUCP (The Doctor) writes:

> <Stuff about Cray 3>  This 10in cube..........

Was the DARPA spec for a 10in cube or 10 cubic inches? :-):-):-)

>detail about it, but the main issue is they are using GaAs chips which are
>very miniaturized.

Nope. The Gas chips are pretty tame, size-wise. Its the packaging 
method that connects things in the 3rd dimension with 12,000 hair-thin
wires from board to board that boggles the mind. 

To save on the 3rd dimension they also have to grind down the *thickness*
of the die as they come from Gigabit, else a basic cpu would be 2 inches
think, not 1 inch. Gag! what does that do to the net yield?

Bye,

Paul K. Rodman
rodman@Multiflow.com