Xref: utzoo comp.arch:12852 comp.sys.intel:1072
Path: utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!zaphod.mps.ohio-state.edu!usc!apple!vsi1!daver!dlr
From: dlr@daver.UU.NET (Dave Rand)
Newsgroups: comp.arch,comp.sys.intel
Subject: Re: 80960KA and KB
Message-ID: <1989Dec22.055206.4848@daver.UU.NET>
Date: 22 Dec 89 05:52:06 GMT
References: <1989Dec20.014428.9785@daver.UU.NET>
Reply-To: dlr@daver.UUCP (Dave Rand)
Organization: Association for the Prevention of Polar Bears and Kangaroos
Lines: 17

In article <1989Dec20.014428.9785@daver.UU.NET> dlr@daver.UU.NET (Dave Rand) writes:
>Does anyone know the die size and technology used on the 80960KA and
>80960KB parts?

Well - the die size is 400x400, in case anyone is interested. No one
replied, so we cracked one open to have a peek. The pads are all
on one corner of the die (strange, just like the pinout :-), and they
appear to use a multi-layer assembly to carry the signals to the
external PGA pins. The die looks packed, with features right to
the edge where there are not pads. I assume that it is 1.2 micro
geometry, but we haven't checked this yet. If anyone has more
information, please let me know.

Wonder if this voids the warranty?
-- 
Dave Rand
{pyramid|hoptoad|sun|vsi1}!daver!dlr	Internet: dlr%daver@uunet.uu.net