Path: utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!ucsd!ucsdhub!hp-sdd!hp-pcd!hpfcso!hpldola!hp-lsd!steveb
From: steveb@hp-lsd.COS.HP.COM (Steve Bourgault)
Newsgroups: comp.sys.hp
Subject: Survey Request
Message-ID: <8250020@hp-lsd.COS.HP.COM>
Date: 1 Feb 90 22:00:48 GMT
Organization: HP Logic Systems Division - ColoSpgs, CO
Lines: 17


The first response to this basenote is a survey request for the way that
HP products (Logic Systems Division in particular) are packaged.  I
realize that this deviates a bit from the intent of this notes category,
but its readers are the target audience that this survey is aimed at.  I
am posting Betsy's request so that she may hopefully get feedback that
will give her ideas on how to improve the packaging of our products.
You have received Logic Systems Division products is you have ever
purchased any of the 64XXX HP product numbers (cross-compilers,
assemblers, debuggers, emulation, etc.).  Betsy would still like to hear
from you even if you have never bought any of our products, but have
some ideas/opinions on how hardware, software, manuals, and other
documentation should be packaged.

Thank you very much,

Steve Bourgault