Path: utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!cs.utexas.edu!uunet!jarthur!spectre.ccsf.caltech.edu!tybalt.caltech.edu!toddpw From: toddpw@tybalt.caltech.edu (Todd P. Whitesel) Newsgroups: sci.electronics Subject: Re: PAL's vs gates Message-ID: <1990Feb9.214647.22868@spectre.ccsf.caltech.edu> Date: 9 Feb 90 21:46:47 GMT References: <358@poppy.warwick.ac.uk> <8590@ingr.com> <2320@dataio.Data-IO.COM> <19023@crg5.UUCP> <3120@optilink.UUCP> Sender: news@spectre.ccsf.caltech.edu Organization: California Institute of Technology Lines: 14 elliott@optilink.UUCP (Paul Elliott x225) writes: >If anyone out there knows of an EP310-equivalent functionality part in a SMT >package, let me know. Even a low-power CMOS 16L8/16R8 would be nice. I know this is obvious, but haven't you asked your supplier? Almost everything from TI with 40 pins or less is available in DIP and SMT, because TI is committed to both package types and the advantages of each. I don't work for TI, but they have sent me lots of free data books. Todd Whitesel toddpw @ tybalt.caltech.edu