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From: tom@ismdqa.intel.com (Tom Soukup ~)
Newsgroups: comp.sys.ibm.pc,comp.sys.intel
Subject: Re: Burnin' hot math co-processors - heat sinks
Message-ID: <1776@inews.intel.com>
Date: 12 Mar 90 17:36:19 GMT
References: <1990Mar6.033339.2016@cs.dal.ca> <39@loop.UUCP>
Sender: news@inews.intel.com
Reply-To: tom@ismdqa.UUCP (Tom Soukup ~)
Organization: Microprocessor Component Group, Intel Corp., Santa Clara, CA
Lines: 24

In article <39@loop.UUCP> keithl@loop.UUCP (Keith Lofstrom) writes:
>In article <1990Mar6.033339.2016@cs.dal.ca> lane@cs.dal.ca (John Wright/Dr. Pat Lane) writes:
>>I asked him about putting a heat sink on the chip and he recommended 
>>against it, especially gluing one on with epoxy, since this might disrupt
>>the chips own heat dissapation ability and make things worse.
>>
[Stuff deleted]
>
>Note: if you do try a heat sink, find a sheet of thermoset epoxy to mount it.
>Trying to smear on liquid epoxy may create bubbles and voids which cause
>stress and lead to failure - another reason most people shouldn't add their
>own heat sinks.  And be sure to let the rest of us know how it turned out!

The most important thing to here is to make sure that the heat sink is
attached using a good thermal conductor.  If you use plain epoxy, you might
acutally insulate the co-processor, preventing heat dissipation.  

Tom Soukup.

PS:  This is my own opinion.  I don't speak for Intel.
________________________________________________________________________________
DISCLAMER:  Intel doesn't agree with much of anything that I say.
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